System design using high density packaging and multi chip modules /
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| OCLC: | 48171456 |
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| Main Author: | |
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| Language: | English |
| Published: |
2000.
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| Format: | Thesis Monograph Microform Note that CRL will digitize material from the collection when copyright allows. |
| Physical Description: | 2 microfiches. |
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| Place of Publication: | Switzerland. |