Studies on via coupling on multilayer printed circuit boards /
Saved in:
| OCLC: | 43208898 |
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| 主要作者: | |
| 企业作者: | |
| 语言: | English |
| 出版: |
Oulu :
Oulun yliopisto,
c1999.
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| 丛编: | Acta Universitatis Ouluensis. Technica ;
no. 134. |
| 主题: | |
| 格式: | Thesis Monograph Note that CRL will digitize material from the collection when copyright allows. |