Studies on via coupling on multilayer printed circuit boards /
Sparad:
| OCLC: | 43208898 |
|---|---|
| Huvudupphovsman: | |
| Institutionell upphovsman: | |
| Språk: | English |
| Publicerad: |
Oulu :
Oulun yliopisto,
c1999.
|
| Serie: | Acta Universitatis Ouluensis. Technica ;
no. 134. |
| Ämnen: | |
| Materialtyp: | Lärdomsprov Monograph Note that CRL will digitize material from the collection when copyright allows. |