Studies on via coupling on multilayer printed circuit boards /
Shranjeno v:
| OCLC: | 43208898 |
|---|---|
| Glavni avtor: | |
| Korporativna značnica: | |
| Jezik: | English |
| Izdano: |
Oulu :
Oulun yliopisto,
c1999.
|
| Serija: | Acta Universitatis Ouluensis. Technica ;
no. 134. |
| Teme: | |
| Format: | Thesis Monograph Note that CRL will digitize material from the collection when copyright allows. |