Studies on via coupling on multilayer printed circuit boards /
Gardado en:
| OCLC: | 43208898 |
|---|---|
| Autor Principal: | |
| Autor Corporativo: | |
| Idioma: | English |
| Publicado: |
Oulu :
Oulun yliopisto,
c1999.
|
| Series: | Acta Universitatis Ouluensis. Technica ;
no. 134. |
| Subjects: | |
| Formato: | Thesis Monograph Note that CRL will digitize material from the collection when copyright allows. |