Studies on via coupling on multilayer printed circuit boards /
Enregistré dans:
| OCLC: | 43208898 |
|---|---|
| Auteur principal: | |
| Collectivité auteur: | |
| Langue: | English |
| Publié: |
Oulu :
Oulun yliopisto,
c1999.
|
| Collection: | Acta Universitatis Ouluensis. Technica ;
no. 134. |
| Sujets: | |
| Format: | Thèse Monograph Note that CRL will digitize material from the collection when copyright allows. |