Studies on via coupling on multilayer printed circuit boards /
Saved in:
| OCLC: | 43208898 |
|---|---|
| Hovedforfatter: | |
| Institution som forfatter: | |
| Sprog: | English |
| Udgivet: |
Oulu :
Oulun yliopisto,
c1999.
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| Serier: | Acta Universitatis Ouluensis. Technica ;
no. 134. |
| Fag: | |
| Format: | Thesis Monograph Note that CRL will digitize material from the collection when copyright allows. |