Studies on via coupling on multilayer printed circuit boards /
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| OCLC: | 43208898 |
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| Hlavní autor: | |
| Korporativní autor: | |
| Jazyk: | English |
| Vydáno: |
Oulu :
Oulun yliopisto,
c1999.
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| Edice: | Acta Universitatis Ouluensis. Technica ;
no. 134. |
| Témata: | |
| Médium: | Diplomová práce Monograph Note that CRL will digitize material from the collection when copyright allows. |