Studies on via coupling on multilayer printed circuit boards /
Guardat en:
| OCLC: | 43208898 |
|---|---|
| Autor principal: | |
| Autor corporatiu: | |
| Idioma: | English |
| Publicat: |
Oulu :
Oulun yliopisto,
c1999.
|
| Col·lecció: | Acta Universitatis Ouluensis. Technica ;
no. 134. |
| Matèries: | |
| Format: | Thesis Monograph Note that CRL will digitize material from the collection when copyright allows. |