Studies on via coupling on multilayer printed circuit boards /
में बचाया:
| OCLC: | 43208898 |
|---|---|
| मुख्य लेखक: | |
| निगमित लेखक: | |
| भाषा: | English |
| प्रकाशित: |
Oulu :
Oulun yliopisto,
c1999.
|
| श्रृंखला: | Acta Universitatis Ouluensis. Technica ;
no. 134. |
| विषय: | |
| स्वरूप: | थीसिस Monograph Note that CRL will digitize material from the collection when copyright allows. |