Studies on via coupling on multilayer printed circuit boards /
Enregistré dans:
| OCLC: | 43208898 |
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| Auteur principal: | |
| Collectivité auteur: | |
| Langue: | English |
| Publié: |
Oulu :
Oulun yliopisto,
c1999.
|
| Collection: | Acta Universitatis Ouluensis. Technica ;
no. 134. |
| Sujets: | |
| Format: | Thèse Monograph Note that CRL will digitize material from the collection when copyright allows. |
| Description matérielle: | 87 p. : ill. ; 25 cm. |
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| Bibliographie: | Includes bibliographical references (p. [86]-87) |
| ISBN: | 9514251881 |
| ISSN: | 0355-3213 ; |
| Lieu de publication: | Finland. |