APA (7. basım) Alıntı

Tarvainen, T. (1999). Studies on via coupling on multilayer printed circuit boards. Oulun yliopisto.

Chicago Style (17. basım) Atıf

Tarvainen, Timo. Studies on via Coupling on Multilayer Printed Circuit Boards. Oulu: Oulun yliopisto, 1999.

MLA (8th ed.) Atıf

Tarvainen, Timo. Studies on via Coupling on Multilayer Printed Circuit Boards. Oulun yliopisto, 1999.